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SOI Wafer Silicon On Insulator Semiconductor Wafer

SOI Wafer Silicon On Insulator Semiconductor Wafer

SOI Wafer sizes from 3” to 200mm, some in inventory Ver […]

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  • SOI Wafer sizes from 3” to 200mm, some in inventory
  • Very high quality with tight TTV on device layer thickness
  • Direct Si-Si bonding and double sided SOI available
  • Any Si orientation, any device thickness over 1.5um
  • Single and double side polished
  • Small lot sizes and Laser marking of wafers available
  • Short lead time delivery

Product Specification

MethodFusion bonding
DiameterØ 4″/ Ø 6″ / Ø 8″
Device thickness2 um ~ 300 um
Tolerance+/- 0.5 um ~ 2 um
Orientation<100> / <111> / <110> or others
ConductivityP – type / N – type / Intrinsic
DopantBoron / Phosphorous / Antimony / Arsenic
Resistivity0.001 ~ 100000 ohm-cm
Oxide thickness500A ~ 4 um
Tolerance+/- 5%
Handle wafer>= 300 um
SurfaceDouble sides polished
CoatingOxide and nitride can be supplied on both sides of SOI wafer

SOI wafers are offered with great customizability and the parameters are greatly flexible as per your needs.

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